Consulting Services &
Areas of Expertise |
Oneida
Research Services, Inc. recognizes that not all clients
have the full range of in-house expertise or engineering
staff time to best apply the powerful laboratory techniques
offered by ORS to help solve complex component, packaging,
process, board, and general reliability-related failures
and material analysis problems. For this reason, expert
consulting services are available from ORS Inc. and
industry experts.
Throughout
its 30 years of providing materials analysis services
to the electronics industry, ORS has established on-going
working relationships with experts in the field of applied
analytical chemistry, materials/processing technology,
quality systems, and component reliability. ORS and
its industry experts have a wealth of experience in
applying laboratory technology to solve your materials/processing,
reliability, or process yield problems. We are available
to consult with you, at your facility whenever appropriate,
to provide technical expertise on a wide range of materials
and process technology issues.
Technical
assistance for start-up businesses (e.g. Fiber Optic,
Optoelectronics and MEMS) to assist in package material
selections and compliance with qualification standards
is available to maximize the time and budget constraints
of clients.
Single
to multi-day Training Seminars on various subjects including
Interpretation of RGA Data are available on-site at
your facility.
Call
or contact Daniel
J. Rossiter for information.
On-Line Technical Journal:
Reliability Times
The Reliability Times is an online journal of pertinent articles, notes, links and comments on reliability information for micro/nano machines, electronics, and medical devices.
ORS Technical Affiliates:
Asána Techne contact Mr. Richard Kullberg
MEMS packaging, Getter efficiency and mass flow studies, Hermeticity, Device Lifetime Enhancement.
Electronic Materials Characterizations contact Mr Robert Lowry
Expertise in the area of surface chemistry, cleanliness, corrosion analysis, and moisture protection and control.
Schuessler Consulting contact Mr. Phil Schuessler
Experience in the field of analytical chemistry and materials science in relation to micro-electronic devices, specifically hermetic packaging, Hydrogen outgassing and root cause failure modes of Hybrid devices.
TJ Green Associates LLC contact Mr Thomas J Green
Provides training seminars and consulting services with expertise in materials and processes used in assembly of Hybrids, Multi Chip Modules and RF/MMIC Modules. Professional courses include Pre Cap Visual (TM 2017),
Incoming Inspection, Process Certification and Defect Recognition, Wirebond, Hermeticity and Near Hermetic Packaging Concepts.
Areas
of Expertise:
Hermetic
Package Analysis:
°
Moisture Control
° Corrosion Control
° Specialized Leak Testing
° Internal Vapor Analysis (IVA™ / RGA)
° Resolution of Moisture Measurement Conflicts
° Outgassing of Materials Internal to Hermetic Packages
(e.g. adhesives, plated materials, etc.)
° Hydrogen Desorption/Outgassing
° Internal Condensation Effects
° New Flux Technology
° Organic Materials Identification
° Absorption, Adsorption, and Chemisorption of Water
Component
Reliability:
°
Process Control
° Adhesive Selection
° Component Failure Analysis
° Electronic Assembly Soldering
° Military Specifications / Standards
° Wire Bonding Process Improvements
° Chlorofluorocarbon Solvent Elimination
° Hybrid Packaging Materials Technology
° Contamination Identification and Control Including
Human-Sourced Ionic and Particulate
Contaminants
° Cleaning Processes and Procedures
Controlling
Process Chemicals:
°
Chemical Specifications
° Purity Control
° Laboratory Methods
° Acceptance Criteria
° Acceptance Screening Procedures
° Customer/Supplier Relationships
Training
Seminars:
°
Interpretation of RGA Data
°
Failure Analysis Techniques
° Hydrogen Desorption Studies
° Test Method 5011 Rationale and Testing of Adhesives
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