Destructive Physical Analysis |
Destructive
Physical Analysis (DPA) verifies and documents the quality
of device processing steps to avoid defects that will
adversely affect performance. By disassembling, testing
and inspecting a device, a complete profile can be created
to determine how well a device conforms to design and
process requirements. A complete DPA program typically
consists of a systematic and progressive series of environmental
and mechanical tests. In some cases defects revealed
in a device can result in rejection of an entire lot
of devices.
°
External Visual Inspection... to assess overall
exterior quality and workmanship.
°
Real Time X-Ray Inspection... to nondestructively
detect internal defects.
°
Particle Impact Noise Detection... to detect
loose particles inside a device cavity.
°
Hermeticity and Internal Vapor Analysis... to quantify
package integrity and internal atmosphere.These test
methods may be used to gauge the susceptibility of a
device to moisture-related failures triggered by poor
sealing processes or internal post-seal outgassing.
°
Internal Visual Inspection via Optical Microscopy
and Scanning Electron Microscopy (SEM)... to evaluate
the quality of passivation, metallization and other
die related components.
°
Glassivation Layer Integrity... to assess the
structural quality
of deposited dielectric films over aluminum metallized
devices.
°
Bond Strength... to measure wire bond strengths
and evaluate bond strength distributions.
°
Die Shear Strength... to determine the integrity
of materials and procedures used to attach die or surface
mounted passive elements to package headers or other
substrates.
|
