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Failure
analysis can provide detailed information regarding
the performance of materials and devices in their intended
end use application. When a device or material does
not meet its performance expectations, a failure analysis
should be performed to identify the root cause of failure.
The information presented in the root cause failure
analysis will allow the product designer and manager,
as well as the test and process engineers, to identify
design, selection, test, and process deficiencies. Recommendations
for corrective actions from the failure analysis report
can then be evaluated and implemented to enhance product
reliability and performance. By having an unbiased failure
analysis performed by an independent test laboratory,
the liability of a failed device or material can be
converted into an asset, resulting in production of
higher quality products.
A
failure analysis requires some or all of the following
activities: sample failure history and selection, nondestructive
testing, destructive testing, materials analysis, determination
of failure mode and mechanism, detailed written report
of findings, and recommendations.
Some
common failure analysis processing schemes:
Electrical/Electronic Component
Failure Analysis
° Obtain sample background and stress history
° "As received" visual inspection
° Verify failed condition
° Nondestructive analysis (Real Time X-Ray, Hermeticity)
° Decapsulation/Disassembly
° Internal Inspection (e.g. Visual, SEM/EDX)
° Materials Analysis (e.g. EDX, Auger, XRF, FTIR)
° Fault Isolation
° Determine Failure Mode and Mechanism
° Compile Detailed Test Report
Material/Metallurgical
Failure Analysis
° Obtain sample background and failure history
° "As received" visual inspection
° Nondestructive analysis
° Scanning Electron Microscopy
° Materials Analysis (e.g. EDX, Auger, XRF, FTIR)
° Cross -Sectional Analysis
° Determine Failure Mode and Mechanism
° Compile Detailed Test Report
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