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8282 Halsey Road
Whitesboro, NY 13492
Phone: (315) 736-5480
Fax: (315) 736-9321


For further information,
please contact:
Deborah Delluomo
Phone: (315) 736-5480 ext. 2202

mail to:dadelluomo@ors-labs.com

mail to:dadelluomo@ors-labs.com

Materials Outgassing & Characterization Studies

ORS has developed a method to characterize the outgassing of a large variety of samples. This method could be described as follow.

The Raw Sample may have many forms like :


   Metal (Kovar, ...)



   Adhesives (Epoxy, ...)

Raw Materials



End products (Microelectronics packages , ...)



Typical study procedure:
1. The sample is hermetically sealed in a clean and dry glass ampoule under controlled atmosphere (dry Nitrogen for example).

2. A thermal stress is then applied and the sample outgasses in the hermetic enclosure.

3. Finally, an IVA™ test is performed on the ampoule.

4. The test results give the complete gas picture (sealing atmosphere + outgassed substances).

Application Examples:
Hydrogen Outgassing from Package Kovar

Hydrogen is known to outgass from Kovar alloy when submitted to high temperatures.
This phenomenon is particularly critical in AsGa technology, for example, where
hydrogen can lead to failures. Therefore, focus is put on lowering and controlling
the hydrogen level.

The glass ampoule sealing can prove very valuable to characterize Hydrogen
outgassing from metal packages. The various package elements (lid, walls, …)
can be separated and outgassed individually. Various bake time and temperatures
can be used to optimize pre-seal prebakes.

Note: It is possible to seal a sample several times. A possible application is to draw an outgassing curve as a function of time for a specific temperature.

Epoxy Outgassing
Moisture and CO2 are generally the main compounds outgassed from epoxy materials mainly because of under curing or over curing problems.

Epoxy materials have specific outgassing signatures which are easily identified and quantitated with the use of glass ampoules; this technique is useful to optimize pre-seal bakeout and to identify thermal stress by-products.

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