Real Time
X-Ray Inspection |
Real
Time X-Ray can provide internal inspection of a sample
while moving, rotating, and tilting the sample at the
sub-micron level, <1 µm focal spot. With Real
Time X-Ray, ORS offers the microelectronic, semiconductor
and PCBA industries the capability for internal inspection
of the smallest devices and packages at the highest
magnification and resolution. Adding Real Time X-ray
inspection to our standard high resolution film X-ray
inspection capability assures you that ORS is equipped
to meet your radiographic testing needs.
 Information
Obtained
This non-destructive technique offers immediate and
thorough analysis of complex structures of varying densities.
Inspection of assemblies can be performed with submicron
defect recognition. Percent die attachment voiding,
solder sphere formation, void percentage, ball diameter,
wire sweep, user adjustable image enhancements and distance
measurement are possible. Real Time X-Ray can also be
a complimentary technique providing critical information
for the proper implementation
of subsequent analytical techniques.
Capabilities
° Submicron spot size
° Automatic void identification and measurement
software
° Maximum inspection area of 18" by 16"
(458mm by 407mm)
° Image analysis and measurement software
° System (geometric) magnification up to 4800X
(up to 1400X)
° Oblique angle view 0 to 45 degrees
° Digital Imaging
Industries
Microelectronic
Aerospace
Automotive
Medical
Commercial
Applications
Failure Analysis
Process and Quality Control
Reliability
Printed
Circuit Boards
Solder Joint Formation
Metallization Defects and Registrations
Via Alignment
Ball
Grid Arrays
Solder Sphere Formation and Voiding
Die Attach
Ceramic
Packages
Frit Seals
Foreign Material
Die Attach
Bond Wire Sweep
Metal
Packages
Lid Seals
Die Attach
Opaque Particles
Plastic
Packages
Die Attach
Bond Wire Sweep
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