Mechanical,
Environmental and Electrical Testing
° External Visual Inspection
° Internal Visual Inspection
° Sub-micron Real Time X-ray
° High Resolution Film X-ray
° SEM Metallization Inspection
° Glassivation Layer Integrity
° Particle Impact Noise Detection
° Bond Strength
° Ball Shear Strength
° Die Shear Strength
° DC I.V. Curve Tracing
° Damp Heat Storage
° High Temperature Storage
° Low Temperature Storage
° Solder Reflow/Moisture Sensitivity Testing
Gas
Analysis
° Internal Vapor Analysis (IVA™)
(DSCC Suitable to Mil-STD 883/750,
Method 1018)
° Gas Analysis of Sealing Chamber Atmosphere
(Cylinder Rentals Available)
° Material Outgassing Studies
(Adhesives/Hydrogen)
Hermeticity
Testing
° Dye Penetrant
° Dye Impregnation
° Helium Sniff Test
° Leak Site Identification
° Open-Face Leak Testing
Wafer
Lot Acceptance Testing
° Glassivation Thickness
° Metallization Thickness
° Wafer Thickness
° Die Back Metallization
° Via Metallization
° SEM Metallization Inspection
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Optical
Microscopy
° Visual Inspection and Photomicroscopy
° Fluorescence Microscopy
Component
Analysis
° Destructive Physical Analysis
° Construction Analysis
° Failure Analysis
Scanning
Electron Microscopy and Surface Analysis
° Scanning Electron Microscopy (SEM)
° High Resolution Field Emission SEM (FeSEM)
° Robinson Backscattered Electron Imaging
° Voltage Contrast
° Electron Beam Induced Current (EBIC)
° Energy Dispersive X-ray Spectroscopy (EDS)
° Auger Electron Spectroscopy (AES)
° Scanning Acoustic Microscopy (SAM)
Polymeric
Materials Analysis
° Micro-Fourier Transform Infrared
Spectroscopy (Micro-FTIR)
Organic
Mass Spectrometry
° GC/MS
° IVA™/GC/MS
° Solid Phase Mirco-Extraction (SPME)
° Solid Probe or Direct Insertion Probe/MS
° Dynamic Headspace GC/MS
Metals Analysis
° Inductively Coupled Plasma Mass
Spectrometry (ICP/MS)
° Laser Ablation ICP/MS
° XRF Elemental Analysis
Sample
Preparation
° Nitric and Sulfuric Decapsulation
° Wet or Plasma Etch Deglassivation
° Micro Cross-Sectioning
° Junction Staining
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