MATERIALS AND COMPONENT SERVICES OVERVIEW

ORS offers a variety of analytical services to assist you in the Quality Control, Process Monitoring, Failure Investigation or Research & Development of your products. Our goal is to provide you with analytical tools to aid in maintaining and improving the quality of your products.

Testing Services for the Microelectronic Industry
A comprehensive suite of tests evaluating the quality and integrity of microelectronic components and manufacturing practices.

Internal Vapor Analysis (IVA™)
Internal Vapor Analysis (IVA™) is a versatile and precise test procedure developed at ORS for the Residual Gas Analysis (RGA) of hermetic packages. The IVA™ method utilizes advanced Mass Spectrometry techniques to accurately determine the relative concentrations of gas or vapor content in hermetic devices, modules, packages, and inclusions.

Hermeticity Testing
Test methods designed to determine the quality of a hermetic seal. Fine leak rates are quantified using a helium mass spectrometer. Gross leak rates are characterized by perflourocarbons or by dye pentrants. Specialized testing capabilities to measure the leak rate of various other gases or compounds (i.e. Argon, Acetic Acid, etc.) are also available.

Materials Outgassing Studies
The Material Outgassing Characterization test, developed at ORS, is a qualitative and quantitative analysis of the off-gassed gaseous substances desorbed from bulk materials. Outgassing studies may be useful in determining hydrogen desorption rates, adhesive outgassing species (pre and post cure), and to characterize other organic bulk materials used in high reliability components.

Organic Mass Spectrometry
Numerous techniques are available to identify volatile organic compounds, and impurities from a variety of sample matrices. Sensitivity in the ppb range is commonly obtained. A useful technique to identify low level "unknown" organic compounds in IVA™ data.

Construction Analysis
Typically performed on microelectronic devices to determine or evaluate the inherent design and robustness of a component by examining its physical characteristics and quality of workmanship.

Destructive Physical Analysis
Disassembly, testing and inspection of microelectronic devices to determine conformance with applicable design, process and procurement requirements.

Failure Analysis
A comprehensive examination of failed devices or components to verify a reported failure mode, identify the failure mechanism, and recommend corrective actions.

Materials/Surface Analysis
Characterization and identification of the surface, interfaces, and bulk composition of materials.

Chemical Analysis
A variety of analytical techniques are available to generate data supporting the structure, purity and physical characteristics of chemical samples submitted for analysis.

Scanning Acoustic Microscopy
Voids, delaminations, cracks and other anomalies in PEM's, ceramic capacitors, flip chips, BGA's, and other products may be detected by this non-destructive technique. Multiple measurement modes including B-Scan, C-Scan and Through-Scan Transmission provide flexible means for thorough evaluation.

Real Time X-Ray Inspection
This non-destructive technique offers immediate and thorough analysis of complex structures of varying densities. Inspection of assemblies can be performed while moving, rotating, and tilting the sample with sub-micron defect recognition. Traditional high resolution film x-ray is also available.