Oneida Research Services, Inc. recognizes that not all clients have the full range of in-house expertise or engineering staff time to best apply the powerful laboratory techniques offered by ORS to help solve complex component, packaging, process, board, and general reliability-related failures and material analysis problems. For this reason, expert consulting services are available from ORS Inc. and industry experts.

Throughout its 30 years of providing materials analysis services to the electronics industry, ORS has established on-going working relationships with experts in the field of applied analytical chemistry, materials/processing technology, quality systems, and component reliability. ORS and its industry experts have a wealth of experience in applying laboratory technology to solve your materials/processing, reliability, or process yield problems. We are available to consult with you, at your facility whenever appropriate, to provide technical expertise on a wide range of materials and process technology issues.

Technical assistance for start-up businesses (e.g. Fiber Optic, Optoelectronics and MEMS) to assist in package material selections and compliance with qualification standards is available to maximize the time and budget constraints of clients.

Single to multi-day Training Seminars on various subjects including Interpretation of RGA Data are available on-site at your facility.

Call or contact Daniel J. Rossiter for information.

Areas of Expertise:

Hermetic Package Analysis:
° Moisture Control
° Corrosion Control
° Specialized Leak Testing
° Internal Vapor Analysis (IVA™ / RGA)
° Resolution of Moisture Measurement Conflicts
° Outgassing of Materials Internal to Hermetic Packages
   (e.g. adhesives, plated materials, etc.)
° Hydrogen Desorption/Outgassing
° Internal Condensation Effects
° New Flux Technology
° Organic Materials Identification
° Absorption, Adsorption, and Chemisorption of Water

Component Reliability:
° Process Control
° Adhesive Selection
° Component Failure Analysis
° Electronic Assembly Soldering
° Military Specifications / Standards
° Wire Bonding Process Improvements
° Chlorofluorocarbon Solvent Elimination
° Hybrid Packaging Materials Technology
° Contamination Identification and Control Including Human-Sourced Ionic and    Particulate Contaminants
° Cleaning Processes and Procedures

Controlling Process Chemicals:
° Chemical Specifications
° Purity Control
° Laboratory Methods
° Acceptance Criteria
° Acceptance Screening Procedures
° Customer/Supplier Relationships

Training Seminars:
° Interpretation of RGA Data
° Failure Analysis Techniques
° Hydrogen Desorption Studies
° Test Method 5011 Rationale and Testing of Adhesives