Destructive Physical Analysis (DPA) verifies and documents the quality of device processing steps to avoid defects that will adversely affect performance. By disassembling, testing and inspecting a device, a complete profile can be created to determine how well a device conforms to design and process requirements. A complete DPA program typically consists of a systematic and progressive series of environmental and mechanical tests. In some cases defects revealed in a device can result in rejection of an entire lot of devices.

° External Visual Inspection... to assess overall exterior quality and workmanship.

° Real Time X-Ray Inspection... to nondestructively detect internal defects.

° Particle Impact Noise Detection... to detect loose particles inside a device cavity.

° Hermeticity and Internal Vapor Analysis... to quantify package integrity and internal atmosphere.These test methods may be used to gauge the susceptibility of a device to moisture-related failures triggered by poor sealing processes or internal post-seal outgassing.

° Internal Visual Inspection via Optical Microscopy and Scanning Electron Microscopy (SEM)... to evaluate the quality of passivation, metallization and other die related components.

° Glassivation Layer Integrity... to assess the structural quality of deposited dielectric films over aluminum metallized devices.

° Bond Strength... to measure wire bond strengths and evaluate bond strength distributions.

° Die Shear Strength... to determine the integrity of materials and procedures used to attach die or surface mounted passive elements to package headers or other substrates.