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mail to:dadelluomo@ors-labs.com

mail to:dadelluomo@ors-labs.com

Failure Analysis

Failure analysis can provide detailed information regarding the performance of materials and devices in their intended end use application. When a device or material does not meet its performance expectations, a failure analysis should be performed to identify the root cause of failure. The information presented in the root cause failure analysis will allow the product designer and manager, as well as the test and process engineers, to identify design, selection, test, and process deficiencies. Recommendations for corrective actions from the failure analysis report can then be evaluated and implemented to enhance product reliability and performance. By having an unbiased failure analysis performed by an independent test laboratory, the liability of a failed device or material can be converted into an asset, resulting in production of higher quality products.

A failure analysis requires some or all of the following activities: sample failure history and selection, nondestructive testing, destructive testing, materials analysis, determination of failure mode and mechanism, detailed written report of findings, and recommendations.

Some common failure analysis processing schemes:

Electrical/Electronic Component Failure Analysis
° Obtain sample background and stress history
° "As received" visual inspection
° Verify failed condition
° Nondestructive analysis (Real Time X-Ray, Hermeticity)
° Decapsulation/Disassembly
° Internal Inspection (e.g. Visual, SEM/EDX)
° Materials Analysis (e.g. EDX, Auger, XRF, FTIR)
° Fault Isolation
° Determine Failure Mode and Mechanism
° Compile Detailed Test Report

Material/Metallurgical Failure Analysis
° Obtain sample background and failure history
° "As received" visual inspection
° Nondestructive analysis
° Scanning Electron Microscopy
° Materials Analysis (e.g. EDX, Auger, XRF, FTIR)
° Cross -Sectional Analysis
° Determine Failure Mode and Mechanism
° Compile Detailed Test Report

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