h o m e    p a g e
ANALYTICAL SERVICES
Analytical Testing Services
Testing Services Overview
GAS ANALYSIS
Internal Vapor Analysis
(IVA™)
High Resolution IVA
(HR-IVA™)
Hermeticity Testing
Material Outgassing Studies
IVA™ Instrument Sales
Organic Mass Spectrometry
COMPONENT ANALYSIS
Construction Analysis
Destructive Physical Analysis
Micro FT-IR
Failure Analysis
Surface Analysis
Laser Ablation ICP/MS
Acoustic Microscopy
Real Time X-ray Inspection
Scanning Electron Spectroscopy
Auger Electron Spectroscopy
Environmental Testing
XRF Elemental Analysis
Counterfeit Device Screening
CONSULTING SERVICES
Areas of Expertise
SUBMISSION FORMS
Gas Analysis Form
Componet Analysis Form
CLIENT LOGIN
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8282 Halsey Road
Whitesboro, NY 13492
Phone: (315) 736-5480
Fax: (315) 736-9321


For further information,
please contact:
Deborah Delluomo
Phone: (315) 736-5480 ext. 2202

mail to:dadelluomo@ors-labs.com

mail to:dadelluomo@ors-labs.com

Testing Services for
Microelectronic Industry

Component Analysis
° Destructive Physical Analysis
° Construction Analysis
° Failure Analysis
° Internal Water-Vapor Content

X-Ray Inspection
° Sub-micron Real Time X-ray
° High Resolution Film X-ray

Acoustic Microscopy
° Scanning Acoustic Microscopy (SAM)
° A,B,C-Scan, Through-Scan

Optical Microscopy
° Digital Photo Microscopy
° Fluorescence Microscopy

Mechanical, Environmental and Electrical Testing
° External Visual Inspection
° Internal Visual Inspection
° SEM Metallization Inspection
° Glassivation Layer Integrity
° Particle Impact Noise Detection (PIND)
° Bond Strength
° Ball Shear Strength
° Die Shear Strength
° DC I.V. Curve Tracing
° Damp Heat Storage
° High Temperature Storage
° Low Temperature Storage

Polymeric Materials Analysis
° Micro Fourier Transform Infrared    Spectroscopy (Micro-FTIR)
° Thermogravimetric Analysis (TGA)
° Differential Scanning Calorimetry (DSC)

Sample Preparation
° Nitric and Sulfuric Decapsulation
° Wet or Plasma Etch Deglassivation
° Micro Cross-Sectioning
° Junction Staining

Gas Analysis
° Internal Vapor Analysis (IVA™) (Mil-STD    883/750, Method 1018)
° Hermetic Packages, Pouches, Bags,    Vials, Lamps, Blisters
° Gas Analysis of Sealing Chamber    Atmosphere (Cylinder Rentals Available)
° Material Outgassing Studies    (Adhesives/Hydrogen)

Hermeticity Testing
° Fine/Gross Leak Testing
° Dye Penetrant
° Dye Impregnation
° Helium Sniff Test
° Open-Face Leak Testing
° Battery Leak Testing

Organic Mass Spectrometry
° GC/MS
° IVA™/GC/MS
° Solid Phase Mirco-Extraction (SPME)
° Solid Probe or Direct Insertion Probe/MS
° Dynamic Headspace GC/MS

Scanning Electron Microscopy and Surface Analysis
° Scanning Electron Microscopy (SEM)
° High Resolution Field Emission (FeSEM)
° Robinson Backscattered Electron    Imaging
° Voltage Contrast
° Electron Beam Induced Current (EBIC)
° Energy Dispersive X-ray Spectroscopy    (EDS)
° Auger Electron Spectroscopy (AES)

Consulting Services
° RGA Data Interpretation
° Hermetic Package Analysis
° Hydrogen Outgassing
° Process Control
° Component Reliability
° Moisture/Corrosion Control

Testing Methods
° MIL-STD ° ASTM
° JEDEC ° IEC
° TELCORDIA ° ICP


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