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mail to:dadelluomo@ors-labs.com

mail to:dadelluomo@ors-labs.com

Testing Services for
Microelectronic Industry

Component Analysis
° Destructive Physical Analysis
° Construction Analysis
° Failure Analysis
° Internal Water-Vapor Content

X-Ray Inspection
° Sub-micron Real Time X-ray
° High Resolution Film X-ray

Acoustic Microscopy
° Scanning Acoustic Microscopy (SAM)
° A,B,C-Scan, Through-Scan

Optical Microscopy
° Digital Photo Microscopy
° Fluorescence Microscopy

Mechanical, Environmental and Electrical Testing
° External Visual Inspection
° Internal Visual Inspection
° SEM Metallization Inspection
° Glassivation Layer Integrity
° Particle Impact Noise Detection (PIND)
° Bond Strength
° Ball Shear Strength
° Die Shear Strength
° DC I.V. Curve Tracing
° Damp Heat Storage
° High Temperature Storage
° Low Temperature Storage

Polymeric Materials Analysis
° Micro Fourier Transform Infrared    Spectroscopy (Micro-FTIR)
° Thermogravimetric Analysis (TGA)
° Differential Scanning Calorimetry (DSC)

Sample Preparation
° Nitric and Sulfuric Decapsulation
° Wet or Plasma Etch Deglassivation
° Micro Cross-Sectioning
° Junction Staining

Gas Analysis
° Internal Vapor Analysis (IVA™) (Mil-STD    883/750, Method 1018)
° Hermetic Packages, Pouches, Bags,    Vials, Lamps, Blisters
° Gas Analysis of Sealing Chamber    Atmosphere (Cylinder Rentals Available)
° Material Outgassing Studies    (Adhesives/Hydrogen)

Hermeticity Testing
° Fine/Gross Leak Testing
° Dye Penetrant
° Dye Impregnation
° Helium Sniff Test
° Open-Face Leak Testing
° Battery Leak Testing

Organic Mass Spectrometry
° GC/MS
° IVA™/GC/MS
° Solid Phase Mirco-Extraction (SPME)
° Solid Probe or Direct Insertion Probe/MS
° Dynamic Headspace GC/MS

Scanning Electron Microscopy and Surface Analysis
° Scanning Electron Microscopy (SEM)
° High Resolution Field Emission (FeSEM)
° Robinson Backscattered Electron    Imaging
° Voltage Contrast
° Electron Beam Induced Current (EBIC)
° Energy Dispersive X-ray Spectroscopy    (EDS)
° Auger Electron Spectroscopy (AES)

Consulting Services
° RGA Data Interpretation
° Hermetic Package Analysis
° Hydrogen Outgassing
° Process Control
° Component Reliability
° Moisture/Corrosion Control

Testing Methods
° MIL-STD ° ASTM
° JEDEC ° IEC
° TELCORDIA ° ICP


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