Real Time X-Ray can provide internal inspection of a sample while moving, rotating, and tilting the sample at the sub-micron level, <1 µm focal spot. With Real Time X-Ray, ORS offers the microelectronic, semiconductor and PCBA industries the capability for internal inspection of the smallest devices and packages at the highest magnification and resolution. Adding Real Time X-ray inspection to our standard high resolution film X-ray inspection capability assures you that ORS is equipped to meet your radiographic testing needs.

Information Obtained
This non-destructive technique offers immediate and thorough analysis of complex structures of varying densities. Inspection of assemblies can be performed with submicron defect recognition. Percent die attachment voiding, solder sphere formation, void percentage, ball diameter, wire sweep, user adjustable image enhancements and distance measurement are possible. Real Time X-Ray can also be a complimentary technique providing critical information for the proper implementation
of subsequent analytical techniques.

Capabilities
° Submicron spot size
° Automatic void identification and measurement software
° Maximum inspection area of 18" by 16"
   (458mm by 407mm)
° Image analysis and measurement software
° System (geometric) magnification up to 4800X
   (up to 1400X)
° Oblique angle view 0 to 45 degrees
° Digital Imaging

Industries
Microelectronic
Aerospace
Automotive
Medical
Commercial

Applications
Failure Analysis
Process and Quality Control
Reliability

Printed Circuit Boards
Solder Joint Formation
Metallization Defects and Registrations
Via Alignment

Ball Grid Arrays
Solder Sphere Formation and Voiding
Die Attach

Ceramic Packages
Frit Seals
Foreign Material
Die Attach
Bond Wire Sweep

Metal Packages
Lid Seals
Die Attach
Opaque Particles

Plastic Packages
Die Attach
Bond Wire Sweep